Browsing Engineering (Faculty of) by Author "Kim, Samuel"
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Dynamic and Quasi-Static Response of Warm and Hot Formed Aluminum Beams Under Three-Point Bending
Kim, Samuel (University of Waterloo, 2018-01-23)This thesis investigates the effect of elevated temperature forming on the impact resistance of three aluminum alloys, AA6013-T6, AA7075-T6, and a developmental 7000-series alloy (designated AA7xxx-T76). Both die quenching ... -
Novel Methods in Ball Bond Reliability Using In-Situ Sensing and On-Chip Microheaters
Kim, Samuel (University of Waterloo, 2013-01-18)Wire bonding is the process of creating interconnects between the circuitry on a microchip and PCB boards or substrates so that the microchip can interact with the outside world. The materials and techniques used in this ... -
Process parameters for hot stamping of AA7075 and D-7xxx to achieve high performance aged products
Omer, Kaab; Abolhasani, Atekeh; Kim, Samuel; Nikdejad, Tirdad; Butcher, Clifford; Wells, Mary; Esmaeili, Shahrzad; Worswick, Michael (Elsevier, 2018-07)This work examines the necessary process parameters for die quenching (DQ) during hot stamping and subsequent age hardening and paint bake cycle (PBC) response for two alloys: AA7075 and a developmental 7xxx alloy (referred ...