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Robust thermal control for CMOS-based lab-on-chip systems

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dc.contributor.authorMartinez-Quijada, Jose
dc.contributor.authorMa, Tianchi
dc.contributor.authorHall, Gordon H.
dc.contributor.authorReynolds, Matt
dc.contributor.authorSloan, David
dc.contributor.authorCaverhill-Godkewitsch, Saul
dc.contributor.authorGlerum, D. Moira
dc.contributor.authorSameoto, Dan
dc.contributor.authorElliott, Duncan G.
dc.contributor.authorBackhouse, Christopher J.
dc.date.accessioned2018-04-20T16:14:59Z
dc.date.available2018-04-20T16:14:59Z
dc.date.issued2015-07-01
dc.description.abstractThe need for precise temperature control at small scales has provided a formidable challenge to the lab-on-chip community. It requires, at once, good thermal conductivity for high speed operation, good thermal isolation for low power consumption and the ability to have small (mm-scale) thermally independent regions on the same substrate. Most importantly, and, in addition to these conflicting requirements, there is a need to accurately measure the temperature of the active region without the need for device-to-device calibrations. We have developed and tested a design that enables thermal control of lab-on-chip devices atop silicon substrates in a way that could be integrated with the standard methods of mass-manufacture used in the electronics industry (i.e. CMOS). This is a significant step towards a single-chip lab-on-chip solution, one in which the microfluidics, high voltage electronics, optoelectronics, instrumentation electronics, and the world-chip interface are all integrated on a single substrate with multiple, independent, thermally-controlled regions based on active heating and passive cooling.en
dc.description.sponsorshipNatural Sciences and Engineering Research Canada (NSERC)en
dc.description.sponsorshipTeledyne-DALSA Semiconductoren
dc.identifier.urihttp://dx.doi.org/10.1088/0960-1317/25/7/075005
dc.identifier.urihttp://hdl.handle.net/10012/13143
dc.language.isoenen
dc.publisherInstitute of Physicsen
dc.rightsAttribution 3.0 Unported*
dc.rights.urihttps://creativecommons.org/licenses/by/3.0/*
dc.subjectBioMEMSen
dc.subjectlab-on-chipen
dc.subjectmicrothermalen
dc.subjectmicrofluidicsen
dc.titleRobust thermal control for CMOS-based lab-on-chip systemsen
dc.typeArticleen
dcterms.bibliographicCitationMartinez-Quijada, J., Ma, T., Hall, G. H., Reynolds, M., Sloan, D., Caverhill-Godkewitsch, S., … Backhouse, C. J. (2015). Robust thermal control for CMOS-based lab-on-chip systems. Journal of Micromechanics and Microengineering, 25(7), 075005. https://doi.org/10.1088/0960-1317/25/7/075005en
uws.contributor.affiliation1Faculty of Scienceen
uws.contributor.affiliation2Biologyen
uws.peerReviewStatusRevieweden
uws.scholarLevelFacultyen
uws.typeOfResourceTexten
uws.typeOfResourceTexten

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