Robust thermal control for CMOS-based lab-on-chip systems
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Date
2015-07-01
Authors
Martinez-Quijada, Jose
Ma, Tianchi
Hall, Gordon H.
Reynolds, Matt
Sloan, David
Caverhill-Godkewitsch, Saul
Glerum, D. Moira
Sameoto, Dan
Elliott, Duncan G.
Backhouse, Christopher J.
Journal Title
Journal ISSN
Volume Title
Publisher
Institute of Physics
Abstract
The need for precise temperature control at small scales has provided a formidable challenge to the lab-on-chip community. It requires, at once, good thermal conductivity for high speed operation, good thermal isolation for low power consumption and the ability to have small (mm-scale) thermally independent regions on the same substrate. Most importantly, and, in addition to these conflicting requirements, there is a need to accurately measure the temperature of the active region without the need for device-to-device calibrations. We have developed and tested a design that enables thermal control of lab-on-chip devices atop silicon substrates in a way that could be integrated with the standard methods of mass-manufacture used in the electronics industry (i.e. CMOS). This is a significant step towards a single-chip lab-on-chip solution, one in which the microfluidics, high voltage electronics, optoelectronics, instrumentation electronics, and the world-chip interface are all integrated on a single substrate with multiple, independent, thermally-controlled regions based on active heating and passive cooling.
Description
Keywords
BioMEMS, lab-on-chip, microthermal, microfluidics