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dc.contributor.authorKam, Nicholas
dc.contributor.authorHook, Michael David
dc.contributor.authorTang, Tanya
dc.contributor.authorMayer, Michael
dc.date.accessioned2020-02-04 18:09:34 (GMT)
dc.date.available2020-02-04 18:09:34 (GMT)
dc.date.issued2019-08
dc.identifier.urihttp://hdl.handle.net/10012/15613
dc.descriptionThe final publication is available at Elsevier via https://doi.org/10.1016/j.mejo.2019.05.009. © 2019. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/en
dc.description.abstractCircuits on glass technology have recently developed in applications such as interposers, fibre optics, and displays. We report an automatable method towards interconnecting to glass circuits via wire bonding with maintained transparency. The method is based on wire bonding Au-Ag, using 25 μm diameter 99.99% pure Au wire. A 5 nm Ti and 500 nm Ag base film are initially deposited via e-beam evaporation onto a standard glass slide, where after wire bonding is preformed. The metal film is then etched from the substrate via ion-milling; remaining intact only in areas shielded from the beam. Cross-sections of the bonded balls before and after metallization removal show high quality continuous interfaces with no intermetallic or micro void formations. Good reliability was indicated by shear testing, remaining above 100 MPa for at least 8 days of ageing at 200 °C. Strong wire bonds were thus obtained on a glass substrate by deposition and selective removal of a Ag-Ti film.en
dc.description.sponsorshipWe acknowledge financial support from Microbonds, Inc. and the Natural Sciences and Engineering Research Council (NSERC) of Canada. We are grateful for the use of equipment at the University of Waterloo in the Centre for Advanced Materials Joining, the Quantum NanoFab, and WATLab. This infrastructure would not be possible without the significant contributions of CFREF, CFI, Industry Canada, the Ontario Ministry of Research & Innovation and Mike & Ophelia Lazaridis. Their support is gratefully acknowledged.en
dc.language.isoenen
dc.publisherElsevieren
dc.relation.ispartofseries;https://doi.org/10.1016/j.mejo.2019.05.009
dc.subjectcircuitsen
dc.subjectglassen
dc.titleWire bonding on glass substrates via vapour deposition of Ag-Ti filmen
dc.typeArticleen
dcterms.bibliographicCitation. Kam, M.D. Hook, T. Tang, M. Mayer, Wire bonding on glass substrates via vapour deposition of Ag-Ti film, Microelectronics Journal (2019), doi: https://doi.org/10.1016/ j.mejo.2019.05.009.en
uws.contributor.affiliation1Faculty of Engineeringen
uws.contributor.affiliation2Mechanical and Mechatronics Engineeringen
uws.typeOfResourceTexten
uws.peerReviewStatusRevieweden
uws.scholarLevelFacultyen
uws.scholarLevelGraduateen
uws.scholarLevelOtheren


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