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dc.contributor.authorEnrique, Pablo D.
dc.contributor.authorJiao, Zhen
dc.contributor.authorZhou, Norman Y.
dc.contributor.authorToyserkani, Ehsan
dc.date.accessioned2018-05-10 13:37:12 (GMT)
dc.date.available2018-05-10 13:37:12 (GMT)
dc.date.issued2018-08-01
dc.identifier.urihttp://dx.doi.org/10.1016/j.jmatprotec.2018.03.023
dc.identifier.urihttp://hdl.handle.net/10012/13279
dc.descriptionThe final publication is available at Elsevier via http://dx.doi.org/10.1016/j.jmatprotec.2018.03.023 © 2018. This manuscript version is made available under the CC-BY-NC-ND 4.0 license https://creativecommons.org/licenses/by-nc-nd/4.0/en
dc.description.abstractControl of splat thickness in an electrospark deposition (ESD) process can be used to improve the mechanical properties of deposited Inconel 718. The lower cooling rates of thicker deposition splats obtained through higher energy ESD parameters result in greater subgrain coarsening and lower microhardness. A subgrain growth model and Hall-Petch relationship are used to quantify the extent of subgrain coarsening and the influence of splat thickness on hardness, with a 4.5 times reduction in splat thickness achieving a 20% increase in microhardness.en
dc.description.sponsorshipNatural Sciences and Engineering Research Council of Canada (NSERC)en
dc.description.sponsorshipCanada Research Chairs (CRC) Programen
dc.description.sponsorshipHuys Industriesen
dc.language.isoenen
dc.publisherElsevieren
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 International*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.subjectCellular dendritic subgrainen
dc.subjectElectrospark depositionen
dc.subjectMicrohardnessen
dc.subjectMicrostructureen
dc.subjectNickel superalloyen
dc.titleDendritic coarsening model for rapid solidification of Ni-superalloy via electrospark depositionen
dc.typeArticleen
dcterms.bibliographicCitationEnrique, P. D., Jiao, Z., Zhou, N. Y., & Toyserkani, E. (2018). Dendritic coarsening model for rapid solidification of Ni-superalloy via electrospark deposition. Journal of Materials Processing Technology, 258, 138–143. https://doi.org/10.1016/j.jmatprotec.2018.03.023en
uws.contributor.affiliation1Faculty of Engineeringen
uws.contributor.affiliation2Mechanical and Mechatronics Engineeringen
uws.typeOfResourceTexten
uws.typeOfResourceTexten
uws.peerReviewStatusRevieweden
uws.scholarLevelFacultyen
uws.scholarLevelGraduateen


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