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dc.contributor.authorXu, Di Erick
dc.contributor.authorGomes, Jimy
dc.contributor.authorLyn, Rob
dc.contributor.authorPersic, John
dc.contributor.authorMayer, Michael 14:57:28 (GMT) 14:57:28 (GMT)
dc.description.abstractThe high price of Au has motivated many to look for alternative bonding wire materials in the field of microelectronics packaging. In the present study, the reliability performance of palladium coated silver (PCS) wire in high temperature storage test (HTST) is carried out using 18 μm diameter fine pitch PCS wire. Fine pitch ball bonds are made on Al metallization, with bonded ball diameter (BBD) of 32 ± 0.5 μm and ball height (BH) of 8 ± 0.5 μm. The aging temperature used in HTST is 170 °C and both shear and pull test are used to evaluate the aged ball bonds at regular time intervals. The shear force increases from 9.9 gf at 96 h to 12.5 gf at 192 h, and remains almost constant until 1344 h, and starts dropping gradually until 10.9 gf at 1848 h. The pad lift percentage recorded in pull test gradually drops from 90 % at 96 h to 20 % at 1008 h, and increases to 90 % at 1848 h. The chip side fractography after shear test indicates that the main failure modes are through pad at 96 h, through ball bond at 504 h, and half of both at 168 h, respectively. Cross-sectional images show that the thickness of the intermetallic compound (IMC) layer growth follows parabolic relationship and the rate constant is 0.10 ± 0.02 μm/h½. Gaps are observed along the periphery of the ball bond interface where no IMC is observed. The IMCs are located at the center of the ball bond interface, and the width is 16.0–19.3 μm at 96 h and 17.2–22.7 μm at 1344 h, respectively.en
dc.subjectFine pitchen
dc.subjectPd coated Ag wire bonden
dc.subjecthigh temperature storage testen
dc.subjectintermetallic compounden
dc.titleThermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al Metallizationen
dc.typeConference Paperen
dcterms.bibliographicCitationXu, D. E., Gomes, J., Mayer, M., Lyn, R., & Persic, J. (2015, October). Thermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al Metallization. In International Symposium on Microelectronics (Vol. 2015, No. 1, pp. 000298-000304). International Microelectronics Assembly and Packaging Society.en
uws.contributor.affiliation1Faculty of Engineeringen
uws.contributor.affiliation2Mechanical and Mechatronics Engineeringen

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