Browsing Engineering (Faculty of) by Subject "Process temperature"
Now showing items 1-1 of 1
-
A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization
(University of Waterloo, 2015-09-29)In the past ten years, the increasing price of gold has motivated the wire bonding industry to look for alternative bonding wire materials in the field of microelectronics packaging. A new candidate wire to replace gold ...