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Browsing Mechanical and Mechatronics Engineering by Subject "wear"
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Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding
(University of Waterloo, 2007-12-12)Ultrasonic wire bonding is the most utilized technique in forming electrical interconnections in microelectronics. However, there is a lacking in the fundamental understanding of the process. In order for there to be ...