Browsing Mechanical and Mechatronics Engineering by Subject "copper"
Now showing items 1-2 of 2
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Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding
(University of Waterloo, 2007-12-12)Ultrasonic wire bonding is the most utilized technique in forming electrical interconnections in microelectronics. However, there is a lacking in the fundamental understanding of the process. In order for there to be ... -
Leveraging Atmospheric-Pressure Spatial Atomic Layer Deposition and Machine Learning for Nanomaterial and Device Design
(University of Waterloo, 2023-07-27)The deposition and design of nanometre-scale oxide films is an integral component of the ongoing nanomaterial revolution, from cell phones, to batteries, to photovoltaics. Atmospheric-pressure spatial atomic layer deposition ...