Browsing Mechanical and Mechatronics Engineering by Subject "Reliability"
Now showing items 1-5 of 5
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Assessing Au-Al Wire Bond Reliability Using Integrated Stress Sensors
(University of Waterloo, 2010-04-30)Wire bond reliability testing typically consists of aging bonds in a high temperature environment for long time periods, and removing samples at intervals to assess bond shear strength and characterize the bond cross ... -
Determination of the fracture strength of brittle material thin films at high temperature using MEMS
(University of Waterloo, 2020-01-27)Brittle materials are widely used as structural materials in microelectromechanical systems (MEMS). Their mechanical properties make them suitable for high-temperature environments where MEMS are exposed to different types ... -
Reliable Vehicle State and Parameter Estimation
(University of Waterloo, 2017-09-08)Diverse vehicle active safety systems including vehicle electronic stability control (ESC) system, anti-lock braking system (ABS), and traction control system (TCS) are significantly relying on information about the vehicle's ... -
Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation
(University of Waterloo, 2018-09-19)Microelectronic devices require packaging for mechanical protection and electrical interconnections. Reliability challenges in microelectronics packaging are becoming more severe, as applications demand smaller package ... -
Study of Au Ball Bond Mechanism and Reliability on Pd/Ni/Cu Substrate
(University of Waterloo, 2009-09-03)Microelectronic wire bonding is a manufacturing process used to electrically connect integrated circuits with circuit boards or other substrates. Conventionally, balls are molten at the end of a Au bonding wire and ...