Browsing Engineering (Faculty of) by Subject "numerical analysis"
Now showing items 1-2 of 2
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Experimental and Numerical Thermal Analysis for Advanced Flip Chip Thermo-Compression Bonding via CMOS Microsensor Arrays and Finite Element Modelling
(University of Waterloo, 2017-10-03)Thermo-compression bonding (TCB) relies on uniform thermal distribution during microelectronic packaging processes to ensure reliable interconnects are formed. During any TCB processes, the thermal application must ... -
Non-Invasive Blood Glucose Monitoring Using Electromagnetic Sensors
(University of Waterloo, 2022-05-16)Monitoring glycemia levels in people with diabetes has developed rapidly over the last decade. A broad range of easy-to-use systems of reliable accuracies are now deployed in the market following the introduction of the ...