Browsing Engineering (Faculty of) by Author "Laor, Ariel"
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A Novel 8x8 CMOS Sensor Array for Thermal Compression Bonding with in-situ XYZ Force and Temperature Measurement
Laor, Ariel (University of Waterloo, 2016-05-09)Flip chip is an electronic packaging technology that is becoming more popular in first level electronic packaging as the need for high density electrical interconnects becomes more relevant. The parallel nature of flip ...