Browsing Theses by Subject "microsensor"
Now showing items 1-2 of 2
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Experimental and Numerical Thermal Analysis for Advanced Flip Chip Thermo-Compression Bonding via CMOS Microsensor Arrays and Finite Element Modelling
(University of Waterloo, 2017-10-03)Thermo-compression bonding (TCB) relies on uniform thermal distribution during microelectronic packaging processes to ensure reliable interconnects are formed. During any TCB processes, the thermal application must ... -
Mechanical and Tribological Aspects of Microelectronic Wire Bonding
(University of Waterloo, 2010-04-28)The goal of this thesis is on improving the understanding of mechanical and tribological mechanisms in microelectronic wire bonding. In particular, it focusses on the development and application of quantitative models of ...