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    • Wire bonding on glass substrates via vapour deposition of Ag-Ti film 

      Kam, Nicholas; Hook, Michael David; Tang, Tanya; Mayer, Michael (Elsevier, 2019-08)
      Circuits on glass technology have recently developed in applications such as interposers, fibre optics, and displays. We report an automatable method towards interconnecting to glass circuits via wire bonding with maintained ...


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