Browsing Mechanical and Mechatronics Engineering by Supervisor "Michael, Mayer"
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A Novel 8x8 CMOS Sensor Array for Thermal Compression Bonding with in-situ XYZ Force and Temperature Measurement
(University of Waterloo, 2016-05-09)Flip chip is an electronic packaging technology that is becoming more popular in first level electronic packaging as the need for high density electrical interconnects becomes more relevant. The parallel nature of flip ...