Browsing Mechanical and Mechatronics Engineering by Author "Huang, Yan"
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Study of Au Ball Bond Mechanism and Reliability on Pd/Ni/Cu Substrate
Huang, Yan (University of Waterloo, 2009-09-03)Microelectronic wire bonding is a manufacturing process used to electrically connect integrated circuits with circuit boards or other substrates. Conventionally, balls are molten at the end of a Au bonding wire and ...