Browsing Engineering (Faculty of) by Subject "SAC305"
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Electromigration in solder joints: Towards better understanding using real-time visuals
(University of Waterloo, 2021-04-19)With the increasing demands and consequent miniaturization of electronic devices, electromigration is posing a challenge to the reliability not only of integrated circuits but also of the electronic packages. A methodology ... -
Simplifying Accelerated Electromigration Testing of Solder using Wire-based DUTs
(University of Waterloo, 2021-05-17)A novel and accelerated method for the characterization of Electromigration (EM) in a solder material typically used in electronics packaging is proposed in this report. The method includes a novel approach to prepare EM ...