Cherniaev, AleksandrZeng, YuCronin, DuaneMontesano, John2020-01-132020-01-132019-07https://doi.org/10.1016/j.polymertesting.2019.03.036http://hdl.handle.net/10012/15447The final publication is available at Elsevier via https://doi.org/10.1016/j.polymertesting.2019.03.036. © 2019. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/Recently developed high-pressure resin transfer molding (HP-RTM) processes have enabled the integration of lightweight fiber-reinforced composites into automobiles (e.g., frame and roof components, floor segments), which may also be suitable for energy absorption applications such as front crush structures in high volume production vehicles. Heavy tow stitch-bonded non-crimp fabrics with rapid curing resins have been recently used to fabricate HP-RTM parts; however, there is a lack of mechanical property data in the literature for such materials. To fill this gap and support the development of lightweight automotive structures, this study reports an investigation assessing the microstructure, quasi-static and dynamic mechanical properties of a non-crimp carbon fabric composite manufactured by HP-RTM, as well as properties of the rapid curing neat epoxy resin. The presented study of the microstructure and constituent properties provide data for in-depth microstructural modeling of the processed non-crimp fabric HP-RTM composite. The study reports 18–20% increase in the tensile transverse strength and strain-at-failure at strain rates on the order of 1000 s−1. Measured macroscopic material properties can be used as input data for numerical modeling of automotive composite structures, including simulations of vehicle collisions.enAttribution-NonCommercial-NoDerivatives 4.0 Internationalhigh pressure resin transfer moldingnon-crimp carbon fabricmechanical propertieshigh strain-rate characterizationsplit-hopkinson barQuasi-static and dynamic characterization of unidirectional non-crimp carbon fiber fabric composites processed by HP-RTMArticle