Ding, RuiqiangDai, HanLi, MeichengHuang, JinjerLi, YingfengTrevor, MwenyaMusselman, Kevin P.2018-05-082018-05-082014-01-06http://dx.doi.org/10.1063/1.4855615http://hdl.handle.net/10012/13254This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. The following article appeared in Ding, R., Dai, H., Li, M., Huang, J., Li, Y., Trevor, M., & Musselman, K. P. (2014). The application of localized surface plasmons resonance in Ag nanoparticles assisted Si chemical etching. Applied Physics Letters, 104(1), 011602 and may be found at https://doi.org/10.1063/1.4855615Localized surface plasmons excited by Ag nanoparticles are introduced in the chemical etching process of silicon. A special crateriform structure with gradually varying radius is achieved by the surface electromagnetic field enhancement effect of localized surface plasmons resonance (LSPR). Theoretical analysis demonstrates that the formation kinetics of the crateriform structures conforms to the local electromagnetic field enhancement and forward scattering induced by LSPR. The LSPR assisted photocatalytic etching offers a potential approach for the preparation of the surface microstructures used in optoelectronic devices.enLight-Emitting-DiodesHighly EfficientVisible-LightSiliconParametersMorphologyThe application of localized surface plasmons resonance in Ag nanoparticles assisted Si chemical etchingArticle