Browsing Waterloo Research by Author "Mayer, Michael"
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Real time resistance monitoring during sintering of silver paste
Xu, Di Erick; Kim, Jang Baeg; Hook, Michael David; Jung, Jae Pil; Mayer, Michael (Elsevier, 2018-01-15)Real time resistance monitoring technology is used to study the silver sintering process. Signals of joint resistance show events such as resistance increase to >10 GΩ, abrupt resistance drop from >10 GΩ to <1 kΩ, ... -
Stitch Bond Process of Pd-Coated Cu Wire: Experimental and Numerical Studies of Process Parameters and Materials
Rezvani, Alireza; Mayer, Michael; Qin, Ivy; Brunner, Jon; Chylak, Bob (IMAPS, 2013)Cost reduction is the main driver in the recent transition to Cu wire bonding from predominate Au wire bonding. Other cost reduction in packaging comes from new developments in substrates and lead frames, for example, ... -
Thermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al Metallization
Xu, Di Erick; Gomes, Jimy; Lyn, Rob; Persic, John; Mayer, Michael (IMAPS, 2015-11)The high price of Au has motivated many to look for alternative bonding wire materials in the field of microelectronics packaging. In the present study, the reliability performance of palladium coated silver (PCS) wire in ... -
Wire bonding on glass substrates via vapour deposition of Ag-Ti film
Kam, Nicholas; Hook, Michael David; Tang, Tanya; Mayer, Michael (Elsevier, 2019-08)Circuits on glass technology have recently developed in applications such as interposers, fibre optics, and displays. We report an automatable method towards interconnecting to glass circuits via wire bonding with maintained ...