Browsing Mechanical and Mechatronics Engineering by Subject "wire bonding"
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Mechanical and Tribological Aspects of Microelectronic Wire Bonding
(University of Waterloo, 2010-04-28)The goal of this thesis is on improving the understanding of mechanical and tribological mechanisms in microelectronic wire bonding. In particular, it focusses on the development and application of quantitative models of ... -
Novel Methods in Ball Bond Reliability Using In-Situ Sensing and On-Chip Microheaters
(University of Waterloo, 2013-01-18)Wire bonding is the process of creating interconnects between the circuitry on a microchip and PCB boards or substrates so that the microchip can interact with the outside world. The materials and techniques used in this ...