Browsing Mechanical and Mechatronics Engineering by Subject "RTD"
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Experimental and Numerical Thermal Analysis for Advanced Flip Chip Thermo-Compression Bonding via CMOS Microsensor Arrays and Finite Element Modelling
(University of Waterloo, 2017-10-03)Thermo-compression bonding (TCB) relies on uniform thermal distribution during microelectronic packaging processes to ensure reliable interconnects are formed. During any TCB processes, the thermal application must ...