Browsing Engineering (Faculty of) by Supervisor "Mayer, Michael"
Now showing items 1-7 of 7
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Bonding of Glass-to-Glass for the Development of Ultrafast Microchip Lasers
(University of Waterloo, 2023-04-21)Direct glass-to-glass bonding is important for high-technology components in optics, microfluidics, and microelectromechanical systems applications. The focus of this research is on the design of an ultrafast, pulsed, ... -
Electromigration in solder joints: Towards better understanding using real-time visuals
(University of Waterloo, 2021-04-19)With the increasing demands and consequent miniaturization of electronic devices, electromigration is posing a challenge to the reliability not only of integrated circuits but also of the electronic packages. A methodology ... -
Experimental and Numerical Thermal Analysis for Advanced Flip Chip Thermo-Compression Bonding via CMOS Microsensor Arrays and Finite Element Modelling
(University of Waterloo, 2017-10-03)Thermo-compression bonding (TCB) relies on uniform thermal distribution during microelectronic packaging processes to ensure reliable interconnects are formed. During any TCB processes, the thermal application must ... -
Real time resistance monitoring technology for microjoining process and reliability test
(University of Waterloo, 2017-12-14)New microjoining materials are needed for the soldering of electronic components due to environmental concern, reliability concern, and designing restriction. For example, a new low melting point solder is needed due to ... -
Simplifying Accelerated Electromigration Testing of Solder using Wire-based DUTs
(University of Waterloo, 2021-05-17)A novel and accelerated method for the characterization of Electromigration (EM) in a solder material typically used in electronics packaging is proposed in this report. The method includes a novel approach to prepare EM ... -
Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation
(University of Waterloo, 2018-09-19)Microelectronic devices require packaging for mechanical protection and electrical interconnections. Reliability challenges in microelectronics packaging are becoming more severe, as applications demand smaller package ... -
Test Methods for Characterization of Antibacterial Silver Organometallic Solutions on Textile Fabrics
(University of Waterloo, 2020-01-15)Antimicrobial agents have been incorporated into textile fabrics to inhibit the growth of undesirable odor-producing bacteria. In recent years, a variety of consumer textiles have been commercially released that utilize ...