Browsing Engineering (Faculty of) by Subject "Wire Bonding"
Now showing items 1-3 of 3
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Experimental and Numerical Study of the Mechanical Aspects of the Stitch Bonding Process in Microelectronic Wire Bonding
(University of Waterloo, 2014-01-23)The goal of this thesis is to improve the understanding of the stitch bonding process in microelectronic wire bonding. In particular, it focuses on investigating the effect of the process parameters bonding force, scrub ... -
Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation
(University of Waterloo, 2018-09-19)Microelectronic devices require packaging for mechanical protection and electrical interconnections. Reliability challenges in microelectronics packaging are becoming more severe, as applications demand smaller package ... -
Stitch Bond Process of Pd-Coated Cu Wire: Experimental and Numerical Studies of Process Parameters and Materials
(IMAPS, 2013)Cost reduction is the main driver in the recent transition to Cu wire bonding from predominate Au wire bonding. Other cost reduction in packaging comes from new developments in substrates and lead frames, for example, ...