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    • Ag Nanoparticles and their Application in Low-Temperature Bonding of Cu 

      Alarifi, Hani (University of Waterloo, 2014-01-03)
      Ag nanoparticle (NP) paste was fabricated and used to bond Cu wire to Cu foil at low temperatures down to 433 K. The relatively low bonding temperature promotes this method to be used in polymer-based flexible electronics, ...


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