Mechanical and Mechatronics Engineering Articles (Peer-Reviewed)
This is the collection for the University of Waterloo's Department Mechanical and Mechatronics Engineering peer-reviewed articles.
Waterloo researchers can submit a copy of their peer-reviewed article to this collection.
(IMAPS, 2015-11)The high price of Au has motivated many to look for alternative bonding wire materials in the field of microelectronics packaging. In the present study, the reliability performance of palladium coated silver (PCS) wire in ...
Stitch Bond Process of Pd-Coated Cu Wire: Experimental and Numerical Studies of Process Parameters and Materials (IMAPS, 2013)Cost reduction is the main driver in the recent transition to Cu wire bonding from predominate Au wire bonding. Other cost reduction in packaging comes from new developments in substrates and lead frames, for example, ...
(Biomicrofluidics, 2015-05)Solvent-induced nanocrack formation on polystyrene surface is investigated experimentally. Solubility parameter and diffusion coefficient of alcohols are employed to elucidate the swelling and cracking processes as well ...