Now showing items 1-2 of 2

    • Statistical Techniques and Non-Destructive Testing Methods for Copper Wire Bond Reliability Investigation 

      Hook, Michael (University of Waterloo, 2018-09-19)
      Microelectronic devices require packaging for mechanical protection and electrical interconnections. Reliability challenges in microelectronics packaging are becoming more severe, as applications demand smaller package ...
    • Topological Semimetals 

      Hook, Michael (University of Waterloo, 2012-08-31)
      This thesis describes two topological phases of matter, the Weyl semimetal and the line node semimetal, that are related to but distinct from topological insulator phases. These new topological phases are semimetallic, ...


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